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Exclusive: A New Report Emerges with Sensational Revealing Alongside Specs of iPhone 8

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Apple use to launch its latest smartphones in November. While we are months away from November, leaks and reports about iPhone 8 have started from different corners of the world. But today, we learned the best thing from a new report.

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According to the report, TSMC – the manufacturer of Apple’s iPhone processors has now started the production of 10nm chipsets (Apple A11) for new generations of iPhones. Initially, TSMC encountered some problems in the new chipset but now those bug have been fixed.

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The report also revealed that TSMC will start mass production of this new chipset in May. Besides, the report has also claimed that Apple will start shipping the iPhone 8 in October this year.

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Further, Apple’s product assembly partners – Wistron, Shuo and Foxconn have started staff recruitment to meet the needs of iPhone 8’s production. Talking about the leaked specifications of iPhone 8, it is said to feature 5.8 inch side-to-side OLED display.

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Because the iPhone 8 is going to feature side-to-side display, the signature home key will be missing on the newcomer. It will support fast charging, wireless charging, 3D face recognition and Iris scanning.

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Furthermore, the report also revealed the specifications of iPhone 7s and 7s Plus. The iPhone 7s and 7s Plus are said to feature 4.7 and 5.5 inch LCD display respectively. Both handsets will also use some features of iPhone 8 such as A11 processor and wireless charging.

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